| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper wired polyimide film which increases an electrical insulating property by suppressing abnormal precipitation of a metal plating component, when a copper foil of a copper foil laminated polyimide film with carrier structure by a subtractive or semi-additive method is etched to obtain a polyimide film having fine copper wiring formed thereon, and then when the copper wiring of the film is plated with a metal such as tin. SOLUTION: In the method for manufacturing a copper wired polyimide film with use of a copper foil laminated polyimide film with carrier structure an etching resist layer on a wiring pattern is removed (by peeling off) to expose a polyimide layer, the exposed polyimide surface is cleaned with an etching solution which removes mainly at least one selected from metal types of Ni, Cr, Co, Zn, Sn, and Mo used for the surface treatment of a copper foil, or removes an alloy including at least one selected from the metal types. COPYRIGHT: (C)2007,JPO&INPIT |
