发明名称 Solid state light sheet and encapsulated bare die semiconductor circuits
摘要 An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.
申请公布号 US2007090387(A1) 申请公布日期 2007.04.26
申请号 US20060585724 申请日期 2006.10.24
申请人 ARTICULATED TECHNOLOGIES, LLC 发明人 DANIELS JOHN J.;NELSON GREGORY V.
分类号 H01L33/52;H01L33/56 主分类号 H01L33/52
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