| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering palette in which opening arrangement pattern is variable. SOLUTION: A divider 7 for covering at least one opening 6 is formed, a scoop portion 8 for dropping the divider 7 is provided immediately below a scoop portion 4 for a printed board, and then the divider 7 is dropped into the scoop portion 8 for the divider thus closing a relevant opening 6. COPYRIGHT: (C)2007,JPO&INPIT |
