发明名称 APPARATUS AND METHOD FOR DISCHARGING MOLTEN METAL, AND METHOD FOR FORMING BUMP
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for discharging molten metal, which apparatus can quickly discharge a required amount of solder on the land of a printed circuit board, etc. , and is excellent in the productivity. SOLUTION: The apparatus for discharging molten metal stores the molten metal in a storage chamber having a plurality of nozzle holes, and discharges the liquid droplets of the molten metal from a plurality of the nozzle holes, and integrates the liquid droplets by making them collide with each other during flying. As a result, it is possible to provide a molten metal discharging means capable of flying the liquid droplets of the molten metal having the amount according to the number of the nozzle holes, and to efficiently form the large diameter solder bump having a required amount. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007105739(A) 申请公布日期 2007.04.26
申请号 JP20050296024 申请日期 2005.10.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUKUMOTO HIROSHI;YOKOYAMA YOSHINORI;ENDO KAZUYO
分类号 B23K3/06;B05C5/00;B05D1/26;H01L21/60;H05K3/34 主分类号 B23K3/06
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