发明名称 FOLDED EXPAND-ON-SITE PAPER PACKAGING
摘要 A series of interconnected packing chip precursors that can be formed and transported economically to a packager as a flat sheet and then expanded at the site where they will be used into individual packing chips by folding and separation from the other chips. Preferably, the precursors are formed on a chipboard sheet by forming fold lines and lines of separation and by adding securing means, such as bonding media or connecting features to secure the sides of the expanded packing chip in its final shape. The fold lines and lines of separation can be configured to form jagged or serrated edges on the expand-on-site packing chip, and the chip may also include apertures; the jagged and serrated edges and the apertures cooperating with each other and other aspects of adjacent chips to interlock the chips when they are placed around an item in a package for shipment.
申请公布号 EP1365955(B1) 申请公布日期 2007.04.25
申请号 EP20010994146 申请日期 2001.11.29
申请人 GOERS, JOHN L.;OLIVER, WILLIAM H. 发明人 GOERS, JOHN L.;OLIVER, WILLIAM H.
分类号 B31B1/08;B29D22/00;B29D23/00;B32B3/12;B65D5/50;B65D65/12;B65D65/14;B65D65/28;B65D65/30;B65D81/09;D02G3/00;G09F3/00 主分类号 B31B1/08
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