Electronics assembly and electronics package carrier therefor

摘要

An electronics assembly (10) is provided having a carrier (30) that provides a controlled height variability between electronics packages (50) and a heat sink device (12). The electronics assembly (10) includes a substrate (20) and electronics packages (50) connected to the substrate (20). The assembly (10) also includes a heat sink device (12) positioned in thermal communication with a first side of the electronics packages (50). The assembly (10) further includes a carrier (30) disposed between the substrate (20) and the heat sink device (12). The carrier (30) has a resilient wall (42) that biases the electronics packages (50) towards the heat sink device (12) such that a controlled bond line is provided between the first side of the electronics packages (50) and the heat sink device (12).