| 摘要 |
<p>The invention relates to a method for laser drilling a hole (153, 252) into a multilayer workpiece (150, 250) during which a first laser output (111) removes a first layer (152, 252) inside a partial area (390) of the cross-sectional area of the hole (153, 253) to be drilled, whereby a portion of the first layer (152, 252) remains inside the cross-sectional area. A second laser output removes a second layer (151, 251) inside the entire cross-sectional area (395) of the hole (153, 253) to be drilled. When removing the second layer (151, 251), the remaining portion of the first layer (152, 252) is simultaneously removed therewith. A clean removal of material of the first layer (152, 252) along a defined boundary line (370) is achieved by a partial removal of material along the hole edge. A UV laser beam (111) is preferably used for removing a metallic first layer (152, 252), and an IR laser beam is used for removing a dielectric second layer (151, 251).</p> |
