发明名称 VERTICAL CRACK FORMING METHOD AND VERTICAL CRACK FORMING DEVICE IN SUBSTRATE
摘要 <p>A method for forming a median crack and an apparatus for forming a median crack are provided, where the formation of a deep, straight median crack is possible, and an excellent broken surface of a brittle substrate can be gained as a result of breaking. In the method for forming a median crack in a brittle substrate, the brittle substrate is irradiated with a laser beam along a laser-scribe line to be formed with median cracks on the brittle substrate so as to be heated to a temperature that is no higher than its melting temperature, and thereby, a median crack is created along the laser-scribe line to be formed with median cracks and expanded starting from a notch that has been formed in the brittle substrate, and this method for forming a median crack in a brittle substrate is characterized in that high temperature portions that receive intense radiation from a laser beam, and low temperature portions that receive faint radiation from a laser beam are alternately formed along the laser-scribe line to be formed with median cracks.</p>
申请公布号 KR20070043866(A) 申请公布日期 2007.04.25
申请号 KR20077004796 申请日期 2005.07.29
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 YAMAMOTO KOJI;HASAKA NOBORU
分类号 B23K26/40;B23K26/00;B23K26/38;B28D5/00 主分类号 B23K26/40
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