Computer provided with cooling system

摘要

The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

主权项

1. A computer provided with a cooling system and equipped with a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted, the computer comprising:
a thermo-siphon that is thermally connected to the semiconductor elements mounted on a first side of the module board; a metal plate that is thermally connected to the semiconductor elements mounted on a second side of the module board; a thermally-conductive member that transfers heat from the metal plate to the thermo-siphon in a situation where heat from the semiconductor elements mounted on the second side of the module board is transferred to the metal plate; and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.