Method for forming microelectronic spring structures on a substrate

摘要

The invention relates to a method of forming a molded surface on a substrate (32) using a stamping tool (34) having at least a portion that is translucent, said method comprising pressing said stamping tool (34) into a layer (30) of moldable material on said substrate (32); directing a curing stimulus through at least a portion of said translucent portion of said stamping tool (34), wherein at least a portion of said moldable material (30) is cured.