| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that thermal stress is concentrated on solder between the thermoelement of a thermoelement module and a metallic member, that a crack occurs and the capacity of the thermoelement module and that of a semiconductor module using the module drop. SOLUTION: In the thermoelement module 10, both ends of a plurality of thermoelements 1 are bonded to a pair of insulating substrates 2 through the metallic members 5, and the semiconductor element is mounted on one insulating substrate 2. The metallic member 5 abuts on the end face of the thermoelement 1 at a protrusion 5a whose area is smaller than the end face. The storage part of solder 3 is formed between the periphery of the protrusion 5a and the end face of the thermoelement 1 facing the periphery and is bonded to the insulating substrate 2 through solder 4. An end face opposite to the protrusion 5a abuts on the base of a recess 2a whose area is larger than the end face formed in the insulating substrate 2. The storage part of solder 4 is formed between the inner face of the recess 2a and the outer face of the end of the metallic member 5 facing the inner face. COPYRIGHT: (C)2003,JPO |
