| 摘要 |
A method and an apparatus for peeling a surface protective film (3) attached on the surface of a semiconductor wafer (1) are provided. A heating block (12) is set in proximity to the whole surface of the semiconductor wafer (1), and the whole surface protective film (3) is heated by the heating block. Thus, the air bubbles (50) existing between the semiconductor wafer (1) and the surface protective film (3) are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film (3) is peeled from the semiconductor wafer (1). As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented. |
