| 摘要 |
To provide a piezoelectric device which is capable of increasing heat dissipatability while improving shieldability. A piezoelectric device (10), in which a lid (20) and piezoelectric device chips (12, 16, 17, 13) are superposed and sealed, comprising a first external electrode (22) exposed only to the upper surface of the lid (20), a second external electrode (23) grounded and exposed to the upper surface and lateral surfaces, and electrically conductive joining materials (15, 30) disposed around the entire periphery along the outer edge between the lid (20) and the piezoelectric device chips (12, 16, 17, 18) and connecting and sealing the lid (20) and the piezoelectric device chips (12, 16, 17, 18) and joined to the grounded second external electrode (23). |
