发明名称 |
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate |
摘要 |
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. |
申请公布号 |
US2016197061(A1) |
申请公布日期 |
2016.07.07 |
申请号 |
US201615067145 |
申请日期 |
2016.03.10 |
申请人 |
Bridgelux, Inc. |
发明人 |
West R. Scott;Tong Tao;Kwon Mike;Solomensky Michael |
分类号 |
H01L25/075;H01L33/64;H01L33/62 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Livermore CA US |