| 发明名称 |
Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 摘要 |
A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
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| 申请公布号 |
US7208347(B2) |
申请公布日期 |
2007.04.24 |
| 申请号 |
US20040547173 |
申请日期 |
2004.01.26 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SELIGER NORBERT;WEIDNER KARL;ZAPF JOERG |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/538;H01L25/07 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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