Method for varying the uniformity of a dopant as it is placed in a substrate by varying the speed of the implant across the substrate

摘要

The present invention provides a method for placing a dopant in a substrate and a method for manufacturing an integrated circuit. The method for placing a dopant in a substrate, among other steps, includes providing a substrate ( 340 ) and implanting a dopant within the substrate ( 340 ) using an implant ( 370 ), the implant ( 370 ) moving at varying speeds across the substrate ( 340 ) to provide different concentrations of the dopant within the substrate ( 340 ).