发明名称 Method of forming semiconductor integrated device
摘要 A semiconductor device is provided comprising several device components formed in the same substrate, such as a P-substrate having an offset Nch transistor including N-type source and drain each formed in a P-well spatially separated from one another, and the drain surrounded by a low concentration N-type diffusion layer; an offset Pch transistor including P-type source and drain each formed in an N-well spatially separated from one another, and the drain surrounded by a low concentration P-type diffusion layer; a triple well including a deep N-well, and a P-type IP well formed therein; a normal N-well for forming a Pch MOS transistor; and a normal P-well for forming an Nch MOS transistor; in which simultaneously formed are the low concentration N-type diffusion layer, N-well and normal N-well; the P-well and normal P-well; and the low concentration P-type diffusion layer and IP well.
申请公布号 US7208359(B2) 申请公布日期 2007.04.24
申请号 US20050134386 申请日期 2005.05.23
申请人 RICOH COMPANY, LTD. 发明人 UEDA NAOHIRO;UEDA YOSHINORI
分类号 H01L21/8234;H01L21/8238;H01L27/092 主分类号 H01L21/8234
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