发明名称 X-ray tube cathode assembly and interface reaction joining process
摘要 An x-ray tube cathode assembly ( 28 ) includes a support arm ( 36 ) comprising a first metal. A ceramic insulator ( 70, 82 ) has a first metalized surface ( 72, 86 ) wherein the metalized surfaces comprise a desired amount of the first metal. A first member of filler material ( 90 ) is in contact with the support arm ( 36 ) and the first metalized surface ( 72, 86 ) of the ceramic insulator ( 70, 82 ), the first member of filler material comprising at least a second metal ( 96 a, 96 b) wherein a first alloy system (FIG. 5 ) comprising the first and second metals includes an alloy minimum point percentage composition (P) of the first and second metals having a first alloy system minimum melting point (M) for the alloy minimum point percentage composition that is lower than both of the melting point of the first metal and second metal. A bonding region resulting from heating the cathode assembly causing diffusion bonding to proceed, the bonding region has a layer of alloy comprising the minimum point percentage composition (P) and the heating of the cathode assembly continues to a bonding temperature of at least the first alloy system minimum melting point (M) and holding at that temperature for a desired period of time.
申请公布号 US7209544(B2) 申请公布日期 2007.04.24
申请号 US20040547197 申请日期 2004.02.20
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 XU PAUL;AWAD GEORGE;PERNO SALVATORE;LU QING K.
分类号 H01J35/06;H01J9/04;H01J35/14;H01J35/30 主分类号 H01J35/06
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