发明名称 Semiconductor device having fuses
摘要 A semiconductor device which includes fuses for relieving defective areas in the semiconductor device is described. There is provided a semiconductor device including a semiconductor substrate having a circuit element, an insulating layer provided on the semiconductor substrate, a fuse element formed in the insulating layer, the fuse element including at least two fuse units connected in series, each of the fuse units having a resistor and a fuse connected in parallel, the fuse disposed above the resistor.
申请公布号 US7208781(B2) 申请公布日期 2007.04.24
申请号 US20040941030 申请日期 2004.09.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOMATSU YUKIO;KOYAMA HAJIME
分类号 H01L21/3205;H01L29/73;H01L21/82;H01L21/822;H01L21/8242;H01L23/52;H01L23/522;H01L23/525;H01L27/04;H01L27/10;H01L27/108;H01L29/00;H01L29/768 主分类号 H01L21/3205
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