| 发明名称 |
Wafer level mounting frame for ball grid array packaging, and method of making and using the same |
| 摘要 |
A method of forming a semiconductor package including placing a semiconductor chip in cavities of a semiconductor chip carrier substrate.
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| 申请公布号 |
US7208344(B2) |
申请公布日期 |
2007.04.24 |
| 申请号 |
US20040816413 |
申请日期 |
2004.03.31 |
| 申请人 |
APTOS CORPORATION |
发明人 |
HO CHI SHEN |
| 分类号 |
H01L21/00;H01L21/44;H01L23/498;H01L23/52;H01L23/538 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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