发明名称 Bonding method, bonding apparatus and bonding program
摘要 With an assumption that the three data of the position (X<SUB>1</SUB>, Y<SUB>1</SUB>) of the first positioning pattern 202 and position (X<SUB>2</SUB>, Y<SUB>2</SUB>) of the second positioning pattern 212 of the reference chip 200 , and the position (X<SUB>3</SUB>, Y<SUB>3</SUB>) of the first positioning pattern 232 of the bonding object chip 230 , as well as the length L of a line segment connecting (X<SUB>1</SUB>, Y<SUB>1</SUB>) and (X<SUB>2</SUB>, Y<SUB>2</SUB>), and the angle theta<SUB>2 </SUB>of this line segment with respect to the X axis, are known, the coordinates (X<SUB>4</SUB>, Y<SUB>4</SUB>) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle Deltatheta of the first positioning pattern 232 of the bonding object chip 230 . Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of Deltatheta.
申请公布号 US7209583(B2) 申请公布日期 2007.04.24
申请号 US20040959242 申请日期 2004.10.06
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 ENOKIDO SATOSHI;SUGAWARA KENJI
分类号 G06K9/00;H01L21/60;B23K20/00;B23K31/12;B23K37/04 主分类号 G06K9/00
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