摘要 |
This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).
|