发明名称 Replacement gate process for making a semiconductor device that includes a metal gate electrode
摘要 A method for making a semiconductor device is described. That method comprises forming a polysilicon layer on a dielectric layer, which is formed on a substrate. The polysilicon layer is etched to generate a patterned polysilicon layer with an upper surface that is wider than its lower surface. The method may be applied, when using a replacement gate process to make transistors that have metal gate electrodes.
申请公布号 US7208361(B2) 申请公布日期 2007.04.24
申请号 US20040809853 申请日期 2004.03.24
申请人 INTEL CORPORATION 发明人 SHAH UDAY;BARNS CHRIS E.;DOCZY MARK L.;BRASK JUSTIN K.;KAVALIEROS JACK;METZ MATTHEW V.;CHAU ROBERT S.
分类号 H01L21/8238;H01L21/00;H01L21/336;H01L21/4763;H01L21/84;H01L27/10 主分类号 H01L21/8238
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