Interposer having molded low CTE dielectric

摘要

A method for making an interconnection component is disclosed, including forming a plurality of metal posts extending away from a reference surface. Each post is formed having a pair of opposed end surface and an edge surface extending therebetween. A dielectric layer is formed contacting the edge surfaces and filling spaces between adjacent ones of the posts. The dielectric layer has first and second opposed surfaces adjacent the first and second end surfaces. The dielectric layer has a coefficient of thermal expansion of less than 8 ppm/° C. The interconnection component is completed such that it has no interconnects between the first and second end surfaces of the posts that extend in a lateral direction. First and second pluralities of wettable contacts are adjacent the first and second opposed surfaces. The wettable contacts are usable to bond the interconnection component to a microelectronic element or a circuit panel.

主权项

1. A method for making an interconnection component, comprising:
providing an element having a plurality of substantially rigid solid metal posts extending away from a reference surface, each post having a first and a second opposed end surface and an edge surface extending between the first and second end surfaces, each post having a single monolithic metal region throughout and at the edge surface; then forming a dielectric layer having a coefficient of thermal expansion of less than 8 parts per million per degree Celsius (ppm/° C.) contacting the edge surfaces and filling spaces between adjacent ones of the posts, the dielectric layer having first and second outermost opposed surfaces which are coplanar with the first and second end surfaces, respectively; and completing the interconnection component, the interconnection component having no electrically conductive interconnects between the first and second end surfaces of the posts that extend in a lateral direction between the posts, the interconnection component having first and second pluralities of wettable contacts adjacent the first and second opposed surfaces, respectively, the first and second wettable contacts being usable to bond the interconnection component to at least one of a microelectronic element or a circuit panel, at least one of the first wettable contacts or the second wettable contacts configured for bonding to element contacts on a face of a microelectronic element and at least one of the first wettable contacts or the second wettable contacts configured for bonding to circuit contacts on a face of a circuit panel.