发明名称 Method of manufacturing transparent conductive film
摘要 A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1−H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.
申请公布号 US9406415(B2) 申请公布日期 2016.08.02
申请号 US201314041549 申请日期 2013.09.30
申请人 NITTO DENKO CORPORATION 发明人 Tanabe Mari;Andou Hidehiko;Sugawara Hideo
分类号 C30B33/00;H01B13/00;G06F3/041 主分类号 C30B33/00
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. A method of manufacturing a transparent conductive film having a patterned transparent conductive layer on one surface of a flexible transparent base having a transparent film base, the transparent conductive film having a pattern forming part having the transparent conductive layer on the flexible transparent base and a pattern opening part not having the transparent conductive layer on the flexible transparent base, the flexible transparent base having a thickness of 80 μm or less; comprising the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned; wherein the heating temperature in the heat treatment step is less than 100° C., wherein the transparent conductive layer that is not patterned is formed on a flexible transparent base by a sputtering method, wherein two or more optical interference layers are formed on a side of the flexible transparent film base where the transparent conductive layer is formed, and wherein an optical interference layer of the two or more optical interference layers that is formed closest to the flexible transparent film base comprises an organic substance, or a mixture of inorganic and organic substances, and an optical interference layer of the two or more optical interference layers that is farthest from the flexible transparent film base comprises an inorganic substance.
地址 Osaka JP