发明名称 |
METHOD FOR PRODUCING SEMICONDUCTOR CHIPS USING THIN-FILM TECHNOLOGY AND A SEMICONDUCTOR CHIP PRODUCED USING THIN-FILM TECHNOLOGY |
摘要 |
<p>For semiconductor chips (1) using thin film technology, an active layer sequence (20) is applied to a growth substrate (3), on which a reflective electrically conductive contact material layer (40) is then formed. The active layer sequence is patterned to form active layer stacks (2), and reflective electrically conductive contact material layer (40) is patterned to be located on each active layer stack (2). Then, a flexible, electrically conductive foil (6) is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.</p> |
申请公布号 |
EP1774599(A2) |
申请公布日期 |
2007.04.18 |
申请号 |
EP20050770659 |
申请日期 |
2005.07.20 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
HAHN, BERTHOLD;HAERLE, VOLKER;KAISER, STEPHAN;PLOESSL, ANDREAS |
分类号 |
H01L21/78;H01L21/683;H01L23/00;H01L23/31;H01L33/00;H01L33/40;H01L33/62 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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