| 摘要 |
<p>A mounting board on which a semiconductor chip having multiple connection bumps is to be mounted by flip-chip bonding is disclosed. The mounting board includes multiple connection pads to be electrically connected to the corresponding connection bumps, where the connection pads have respective surfaces coated with solder; and an insulating layer configured to surround the connection pads and isolate the connection pads from each other. Each of the connection pads has a first region and at least one second region to be connected to a corresponding one of the connection bumps. The first region has a surface substantially as high as a surface of the insulating layer and the second region has a surface lower than the surface of the first region.</p> |
