发明名称 Method for Manufacturing Light-Emitting Device
摘要 A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.
申请公布号 US2016240822(A1) 申请公布日期 2016.08.18
申请号 US201615141157 申请日期 2016.04.28
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Chida Akihiro;Hatano Kaoru;Aoyama Tomoya;Komatsu Ryu;Kataniwa Masatoshi
分类号 H01L51/56;H01L27/32;H01L51/52 主分类号 H01L51/56
代理机构 代理人
主权项 1. A method for manufacturing a light-emitting device, comprising the steps of: forming an electrode terminal over a substrate; forming a first electrode layer electrically connected to the electrode terminal; forming a partition wall covering an edge portion of the first electrode layer; forming an organic compound-containing layer over the electrode terminal and the first electrode layer; forming a second electrode layer over the organic compound-containing layer; forming a resin layer over the electrode terminal, the first electrode layer, the partition wall, the organic compound-containing layer and the second electrode layer; exposing the electrode terminal by making a cut surrounding a portion of the resin layer which overlaps with the electrode terminal and removing the portion of the resin layer surrounded by the cut and a portion of the organic compound-containing layer which overlaps with the electrode terminal; and forming a conductive layer in contact with the electrode terminal.
地址 Kanagawa-ken JP