发明名称 |
Method for Manufacturing Light-Emitting Device |
摘要 |
A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal. |
申请公布号 |
US2016240822(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615141157 |
申请日期 |
2016.04.28 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Chida Akihiro;Hatano Kaoru;Aoyama Tomoya;Komatsu Ryu;Kataniwa Masatoshi |
分类号 |
H01L51/56;H01L27/32;H01L51/52 |
主分类号 |
H01L51/56 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing a light-emitting device, comprising the steps of:
forming an electrode terminal over a substrate; forming a first electrode layer electrically connected to the electrode terminal; forming a partition wall covering an edge portion of the first electrode layer; forming an organic compound-containing layer over the electrode terminal and the first electrode layer; forming a second electrode layer over the organic compound-containing layer; forming a resin layer over the electrode terminal, the first electrode layer, the partition wall, the organic compound-containing layer and the second electrode layer; exposing the electrode terminal by making a cut surrounding a portion of the resin layer which overlaps with the electrode terminal and removing the portion of the resin layer surrounded by the cut and a portion of the organic compound-containing layer which overlaps with the electrode terminal; and forming a conductive layer in contact with the electrode terminal. |
地址 |
Kanagawa-ken JP |