FRAME BASED PACKAGE FOR FLIP-CHIP LED

摘要

A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate.

主权项

1. A light emitting device comprising:
a substrate upon which a light emitting element is situated, wherein: the light emitting element comprises an active region that is sandwiched between an n-type semiconductor and a p-type semiconductor, and light emitted from a first light emitting surface of the light emitting element is emitted from at least one light emitting surface of the substrate; contact pads that are formed on a second surface of the light emitting element that is opposite the first light emitting surface, wherein at least a first contact pad is connected to the n-type semiconductor and a second contact pad is connected to the p-type semiconductor; a frame arranged to surround the substrate and light emitting element such that at least a portion of the contact pads and at least a portion of the substrate are not obstructed by the frame; and a cap surrounded by the frame, wherein the cap is in direct contact with the light emitting element.