METHOD OF FABRICATING COPPER INTERCONNECTIONS USING A SACRIFICIAL DIELECTRIC LAYER,申请号KR20027009686-传众专利搜索

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发明名称	METHOD OF FABRICATING COPPER INTERCONNECTIONS USING A SACRIFICIAL DIELECTRIC LAYER
摘要
申请公布号	KR100708427(B1)	申请公布日期	2007.04.18
申请号	KR20027009686	申请日期	2002.07.26
申请人		发明人
分类号	H01L21/768	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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