SEMICONDUCTOR FINGERPRINT IDENTIFICATION SENSOR AND MANUFACTURING METHOD THEREOF

摘要

Disclosed are a semiconductor fingerprint identification sensor and a method for manufacturing the same. The semiconductor fingerprint identification sensor includes: a sensing area, a control area and an interface area; the sensing area, the control area and the interface area are communicated with one another; a fingerprint information sensed in the sensing area is sent to the control area, and is output through the interface area after being processed in the control area; the sensing area includes an insulation layer, an wiring layer, a substrate layer and a protective layer which are stacked in a sequence, the wiring layer is embedded between the insulation layer and the substrate layer, a sensor array is disposed on a side of the substrate layer being in contact with the protective layer, a via hole corresponding to the sensor array is disposed on the substrate layer, the sensor array is electrically connected with a sensing lead circuit of the wiring layer through the via hole. The semiconductor fingerprint identification sensor has advantages of low cost, high signal-to-noise ratio and good reliability.

主权项

1. A semiconductor fingerprint identification sensor, comprising: a sensing area, a control area and an interface area;
wherein the sensing area, the control area and the interface area are communicated with one another; a fingerprint information sensed in the sensing area is sent to the control area, and is output through the interface area after being processed in the control area; the sensing area comprises an insulation layer, an wiring layer, a substrate layer and a protective layer which are stacked in a sequence, the wiring layer is embedded between the insulation layer and the substrate layer, a sensor array is disposed on a side of the substrate layer being in contact with the protective layer, a via hole which corresponds to the sensor array is disposed on the substrate layer, the sensor array is electrically connected with a sensing lead circuit of the wiring layer through the via hole.