| 摘要 |
<p>PURPOSE: A method for fabricating a semiconductor package is provided to prevent a warpage phenomenon caused by a difference of thermal expansion coefficients between a molding resin and a carrier frame by forming a gap between the molding region of a circuit film and the carrier frame. CONSTITUTION: A circuit frame(22) is adhered on a carrier frame(24). A size of a molding region of the circuit frame(22) is smaller than a size of a hole(26) of the carrier frame(24) or the size of the hole(26) of the carrier frame(24) is larger than the size of the molding region of the circuit film(22). A gap(28) of a predetermined interval is formed between each inner faces of the hole(26) of the carrier frame(24) and the molding region of the circuit film(22). A size of a mold having a cavity corresponds to a size of the molding region of the circuit film(22). The molding region of the circuit film(22) is clamped. A contact between final molded resin(32) and the carrier frame is prevented by implanting resin into the cavity of the mold.</p> |
