发明名称 |
Polishing apparatus with thickness measuring means |
摘要 |
<p>A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate. <IMAGE></p> |
申请公布号 |
EP1116552(B1) |
申请公布日期 |
2007.04.18 |
申请号 |
EP20010100187 |
申请日期 |
2001.01.17 |
申请人 |
EBARA CORPORATION |
发明人 |
KIMURA, NORIO;ISOBE, HIDEJI;SHIMIZU, KAZUO;OSAWA, HIROYUKI |
分类号 |
H01L21/304;B24B7/22;B24B37/013;B24B49/04;B24B49/10;H01L21/306 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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