发明名称 |
METHOD AND APPARATUS FOR PRODUCING CO-PLANAR BONDING PADS ON A SUBSTRATE |
摘要 |
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes. |
申请公布号 |
EP1774583(A2) |
申请公布日期 |
2007.04.18 |
申请号 |
EP20050775584 |
申请日期 |
2005.07.26 |
申请人 |
SV PROBE PTE LTD. |
发明人 |
MALANTONIO, EDWARD, L.;LAURENT, EDWARD;HANOON, ILAN |
分类号 |
H01L21/48;G01R1/073;G01R3/00;G01R31/28 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|