Semiconductor light emitting device and method for manufacturing the same

摘要

According to one embodiment, a semiconductor light emitting device includes a structure, a first electrode layer, and a second electrode layer. The structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first electrode layer is provided on the first semiconductor layer side of the structure. The first electrode layer is made of metal and contains a portion contacting the first semiconductor layer. The second electrode layer is provided on the second semiconductor layer side of the structure. The second electrode layer has a metal portion with a thickness of not less than 10 nanometers and not more than 50 nanometers, and a plurality of openings piercing the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers.

主权项

1. A semiconductor light emitting device comprising:
a first electrode layer; a second electrode layer; a first semiconductor layer of a first conductivity type provided between the first electrode layer and the second electrode layer, the first semiconductor layer including a first nitride semiconductor; a second semiconductor layer of a second conductivity type provided between the first semiconductor layer and the second electrode layer, the second semiconductor layer including a second nitride semiconductor; and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the light emitting layer including a third nitride semiconductor; a distance between the first electrode layer and the second electrode layer being not more than 20 micrometers, the first electrode layer including a metal layer, the metal layer contacting the first semiconductor layer, and a thickness of the metal layer being not less than 1 micrometer; and the second electrode layer including a metal portion and a plurality of openings piercing the metal portion in a direction from the second semiconductor layer toward the first semiconductor layer, the metal portion directly contacting the second semiconductor layer, a thickness of the metal portion being not less than 10 nanometers and not more than 50 nanometers, and each of the openings viewed in the direction having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers.