发明名称 |
Semiconductor apparatus including a heat dissipating member |
摘要 |
A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space. |
申请公布号 |
US9437517(B2) |
申请公布日期 |
2016.09.06 |
申请号 |
US201514788853 |
申请日期 |
2015.07.01 |
申请人 |
PANASONIC CORPORATION |
发明人 |
Ochi Takao |
分类号 |
H01L23/367;H01L23/00;H01L23/31;H01L23/433;H01L21/56;H01L23/29;H01L23/495;H01L25/065;H01L23/13 |
主分类号 |
H01L23/367 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A semiconductor apparatus comprising:
a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base, wherein the encapsulant is disposed in the space, in a side view of the base, a peak of the connection member is located inside the space, and the heat dissipating member does not cover any portion of the connection member in plan view. |
地址 |
Osaka JP |