发明名称 SEMICONDUCTOR DEVICE
摘要 According to an embodiment, a semiconductor device includes a semiconductor layer, a first metal layer formed over the semiconductor layer, a barrier film formed over the first metal layer and having an ionization tendency lower than an ionization tendency of the first metal layer, a second metal layer formed over the barrier film and having an ionization tendency higher than an ionization tendency of the metal film, and a third metal layer formed over the second metal layer and having an ionization tendency lower than an ionization tendency of the second metal layer.
申请公布号 US2016260810(A1) 申请公布日期 2016.09.08
申请号 US201514831741 申请日期 2015.08.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SAKAI Masaki
分类号 H01L29/417;H01L21/288;H01L29/66;H01L29/45;H01L29/739 主分类号 H01L29/417
代理机构 代理人
主权项 1. A semiconductor device, comprising: a semiconductor layer; a first metal layer on the semiconductor layer; a barrier film on the first metal layer and having an ionization tendency lower than an ionization tendency of the first metal layer; a second metal layer formed on the barrier film and having an ionization tendency higher than the ionization tendency of the barrier film; and a third metal layer on the second metal layer and having an ionization tendency lower than the ionization tendency of the second metal layer.
地址 Tokyo JP