| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition reduced in surface roughness in etching and a positive resist composition excellent also in resolving power and defocus latitude in contact hole pattern formation. <P>SOLUTION: The positive resist composition comprises: a resin (A) containing two specified repeating units having an alicyclic group and having a velocity of dissolution in an alkali developing solution increased by the action of an acid; and a compound (B) which generates an acid upon irradiation with an active light or a radiation. <P>COPYRIGHT: (C)2003,JPO |
