| 摘要 |
Electronic components in mold are encapsulated by introducing a part of the conditioning gas into the mold cavity during release of the encapsulating material from the mold cavity such that a releasing gas pressure is exerted on the encapsulating material by the conditioning gas. - Encapsulation of electronic components in mold comprises placing the electronic component for encapsulating in a mold cavity, and feeding an encapsulating material to the mold cavity. A part of the mold surface defines the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. A part of the conditioning gas is introduced into the mold cavity during release of the encapsulating material from the mold cavity such that a releasing gas pressure is exerted on the encapsulating material by the conditioning gas. An INDEPENDENT CLAIM is also included for a device (1) for encapsulating an electronic component (12), in particular a semiconductor, with encapsulating material, comprising at least two co-acting mold parts (2, 3) which are mutually displaceable between a molding position, in which the mold parts take up a position for defining at least one mold cavity (4) receiving the electronic component, and an opened position in which the mold parts are situated at a greater distance from each other than in the encapsulating position. A feed mechanism is provided for encapsulating material (5) connecting to the mold cavity. A supply mechanism is provided for a conditioning gas with a decreased oxygen concentration relative to the atmosphere. It is connected to a contact side of at least one of the mold parts. |
