| 发明名称 |
Insulating substrate for IC packages having integral ESD protection |
| 摘要 |
An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed
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| 申请公布号 |
US7205613(B2) |
申请公布日期 |
2007.04.17 |
| 申请号 |
US20050033354 |
申请日期 |
2005.01.07 |
| 申请人 |
SILICON PIPE |
发明人 |
FJELSTAD JOSEPH C.;GRUNDY KEVIN P. |
| 分类号 |
H01L23/62;H02H9/00 |
主分类号 |
H01L23/62 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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