发明名称 |
Airflow guide structure and manufacture thereof |
摘要 |
An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.
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申请公布号 |
US7204750(B2) |
申请公布日期 |
2007.04.17 |
申请号 |
US20040988643 |
申请日期 |
2004.11.16 |
申请人 |
FIRST INTERNATIONAL COMPUTER, INC. |
发明人 |
SHEN BEN HUNG-PING;TSAI CHEI-JU;CHEN HAN-TUN;HUANG TING-CHIANG |
分类号 |
G06F1/16;H05K5/02;G06F1/20;H01L23/467;H05K5/00;H05K7/20 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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