发明名称 Airflow guide structure and manufacture thereof
摘要 An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.
申请公布号 US7204750(B2) 申请公布日期 2007.04.17
申请号 US20040988643 申请日期 2004.11.16
申请人 FIRST INTERNATIONAL COMPUTER, INC. 发明人 SHEN BEN HUNG-PING;TSAI CHEI-JU;CHEN HAN-TUN;HUANG TING-CHIANG
分类号 G06F1/16;H05K5/02;G06F1/20;H01L23/467;H05K5/00;H05K7/20 主分类号 G06F1/16
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