Land grid array packaged device and method of forming same

摘要

A method of packaging an integrated circuit die ( 12 ) includes the steps of providing a foil sheet ( 30 ) and forming a layer of solder ( 32 ) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal ( 34 ) on it and a second, opposing side of the die includes bonding pads ( 14 ). The bonding pads are electrically connected to the solder on the foil sheet with wires ( 16 ). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound ( 20 ). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit ( 10 ).