Hermetically sealed microdevice with getter shield

摘要

A microdevice that comprises a device microstructure ( 38 ) and vent channel ( 34 ) in a wafer ( 14 ) that is sandwiched between a substrate ( 10 ) and a cap ( 16 ). The cap ( 16 ) and substrate ( 10 ) have recesses ( 41, 21 ) around the microstructure ( 22 ) to define a cavity. A vent ( 25 ) is connected to the vent channel ( 34 ) and subsequently to the cavity. The vent ( 25 ) is used to evacuate and seal the microstructure ( 38 ) in the cavity. A getter layer ( 32 ) can be used to maintain the cavity vacuum. An electrical connection can be provided through the vent ( 25 ), vent channel ( 34 ) and cavity to the getter ( 32 ) to electrically ground the getter layer ( 32 ).