| 摘要 |
<p>The present invention relates to a polyimide based flexible copper clad laminate for manufacturing a flexible printed circuit board. The polyimide based flexible copper clad laminate comprises, in order, a copper foil, a thermoset polyimide layer, a thermoplastic polyimide layer, a thermoset polyimide layer, and a copper foil. The present invention also relates to a method for producing the polyimide copper foil laminate. First, a structure of copper foil coated with thermoset polyimide is formed. Then, the thermoset polyimide layers of two of the structures are adhered to each other by thermoplastic polyimide. Finally, after compressing and curing, the polyimide based flexible copper clad laminate according to the present invention is produced.</p> |
