发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a heat sink having a microchannel so that contact area is increased with working fluid. SOLUTION: In the heat sink, an object to be cooled is installed in contact with the outside. The heat sink comprises a cooling zone inside which the microchannel for forming a plurality of channels is formed; an inflow section for allowing the working fluid to flow in; a distributor that is positioned between the inflow section and the cooling zone, and enables the microchannel to distribute the working fluid allowed to flow in via the inflow section; an outflow section for allowing the working fluid via the cooling zone to flow out; and a collector that is positioned between the cooling zone and the outflow section, and collects fluid passing through the microchannel. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007096306(A) 申请公布日期 2007.04.12
申请号 JP20060259339 申请日期 2006.09.25
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 PARK HEE-SUNG;KIM SUN-SOO
分类号 H01L23/473 主分类号 H01L23/473
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