| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for reducing constraint such as the wiring of a substrate while providing a portion with flexibility. SOLUTION: This printed circuit board is provided with a first substrate layer whose elasticity is high, a second substrate layer joined on the first substrate layer whose elasticity is lower, and a flexible layer formed with flexibility by cutting a partial surface at the lower side of the first substrate layer with fixed depth. This printed circuit board is provided with the first substrate layer, the second substrate layer laminated on the first substrate layer whose elasticity is smaller than that of the first substrate layer, and a flexible layer formed with flexibility by cutting the whole partial face at the lower side of the first substrate layer and the second substrate layer on the first substrate layer with fixed depth. COPYRIGHT: (C)2007,JPO&INPIT |
