| 摘要 |
PROBLEM TO BE SOLVED: To simplify the entire structure of a mold 110 used for resin-sealing molding an electronic component, to absorb variations of the thickness of the substrate 400 in resin sealing molding the electronic component, and to efficiently execute mold release operation for a resin-sealed substrate 402. SOLUTION: The mold 110 used for resin sealing molding the electronic component consists of a first mold 111 and a second mold 112, and planar substrate feed setting surfaces 113 having no step are formed on mold matching surfaces (P.L surfaces) of both the molds. Also, a pot block 140 is arranged on the side surface 110a of the mold 110 matching the mold matching surfaces (P.L surfaces) of both the molds so as to be freely joined and separated, and the mold matching surfaces are joined to the pot block 140 and a molten resin material in the pot block 140 is directly injected into a cavity 114. Further, release opening in which the second mold 112 is released in a state that the substrate 402 is affixed on the mold face of the first mold 111 is executed. COPYRIGHT: (C)2007,JPO&INPIT |
