| 摘要 |
PROBLEM TO BE SOLVED: To provide a dividing method of a multiple board whereby dimensional accuracy of individual components obtained by dividing a multiple board is ensured, and the division efficiency is improved. SOLUTION: After the multiple board 5 is baked, first division grooves 11 are formed in such a way that they do not pass through a component forming region U and are extended on a dummy region S. Further, second division grooves 12 are formed in such a way that they extend on borders among individual component forming regions U11 to Umn in the component forming region U, cross with the first division grooves 11 in the dummy region S, and stop in the dummy region S. Then the multiple board 5 is divided along with the first division grooves 11 to obtain multiple board pieces 51 including the component forming region U. Moreover, the multiple board chips 51 are divided along with the second division grooves 12. COPYRIGHT: (C)2007,JPO&INPIT
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