| 摘要 |
PROBLEM TO BE SOLVED: To provide a stem for a semiconductor laser device that is capable of excellently holding adhesiveness between a semiconductor laser element, and to provide its manufacturing method. SOLUTION: The stem (1) for a semiconductor laser device includes a base (10), and a heat sink (11) provided on the base (10). An inclined face (11c) for connecting at least one side face (11a) of the heat sink (11) with the main face (11b) of the heat sink (11) is formed to the heat sink (11). An angle (θ<SB>1</SB>) formed of the side face (11a) of the heat sink (11) and the inclined face (11c) of the heat sink (11) is over 180°and≤225°. COPYRIGHT: (C)2007,JPO&INPIT
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