| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for miniaturizing an LED light emitting device and improving heat dissipation thereof. <P>SOLUTION: An LED device includes a thermally conductive frame for mounting an LED chip, a pair of lead frames to which the electrodes of the LED chip are connected, and a reflector covering a part of the thermally conductive frame and a part of the lead frame and forming a cup-like reflecting surface around the LED chip wherein the light exit direction of the LED chip is substantially perpendicular to the elongating direction of the lead frame. Exposed portion of the thermally conductive frame is a heat sink having a LED light source in which a fitting portion is formed, and a portion engaging with the fitting portion of the LED light source. The heat sink is arranged substantially in parallel with the lead frame and provided with a protrusion secured to a wiring board to which the lead frame is secured. <P>COPYRIGHT: (C)2007,JPO&INPIT |
